Defect Check including Weak Solder, Solder Bridge, Tombstone, Missing Solder and Missing Parts, etc, especially for BGA and CSP, etc.
High test coverage so as to check visual place out of sight by naked eyes and online test, such as rapid inspection while a layer of PCB linear fracture.
Side Inspection in 45 degrees.
Relevant measurement information to evaluate production process, such as the thickness of solder paste and solder volume, etc.
Resolution is 50nm.